Fineplacer PICO

Equipment description

The Fineplacer is a cost effective bonder designed for prototyping or low-volume production, R&D labs and universities. This versatile platform is used in a wide range of micro assembly applications – such as flip-chip bonding, die attach and components requiring a novel bonding approach.

• Max. Force = 21N
• Min. Force = 0.1N
• Sintering under nitrogen, formic acid enriched nitrogen possible
• T_max = 300°C
• Placement accuracy better than 5µm
• Dual camera system for alignment
• In-situ process monitoring

Equipment information