The research activities in this research laboratory can be divided into three categories: 

• Assembly and connection technology
• Life and reliability testing and
• Analytics.

The assembly part of the activities focuses on preparation and assembly of the bonded microelectronic joints. The reliability testings deal with the mechanical, electrical, and thermal integrity of the bonded microelectronic joints. By monitoring the state of a component it is possible to predict the remaining useful life of a component. Below the list of the equipment for these three set of research activities are provided.