The wire bonder can be configured for aluminium or gold wire bonding. Ball bonding can also be carried out using gold wire. The stereo microscope has adjustable focus and zoom and is fitted with a CCD camera. The heated stage allows substrate temperatures of up to 250°C. Bonding parameters for this machine (for bonds 1 and 2) are:

• Ultrasonic capacity (analogous to ‘capacity’ in K&S and MEI bonders) in any units
• Time – duration of ultrasonic application in milliseconds
• Force – downward force exerted by the bonding tool during bonding, in grams

• Manufacturer	tpt
  Model	HB05
  Location	C307

The Fineplacer is a bonder designed for the production of prototypes or small batches, as well as for use in research and development laboratories and universities. This versatile platform is used in a wide range of micro-assembly applications – such as flip-chip bonding, die-attach and components requiring an innovative bonding approach.

• Max. force = 21 N
• Min. force = 0.1 N
• Sintering under nitrogen; nitrogen enriched with formic acid is possible
• _{Tmax =} 300°C
• Placement accuracy better than 5 µm
• Dual-camera system for alignment
• In-situ process monitoring

• Manufacturer	Finetec
  Model	PICO
  Location	C307

The Fineplacer Sigma, a semi-automatic bonder, offers a future-proof assembly and development platform with virtually unlimited applications.

• Max. force = 1000 N
• Min. force = 0.1 N
• Component size: 0.^{5 mm² to 25 mm²}
• Sintering under nitrogen or nitrogen enriched with formic acid is possible
• _{Tmax =} 400°C
• Positioning accuracy better than 1 µm
• In-situ process monitoring in HD
• UHD Vision Alignment System with FPXvision™
• Modular machine platform enables on-site retrofitting throughout the entire service life
• Wide range of supported component presentations (wafer, wafer pack, Gel-Pak®)
• Integrated die picking module
• Synchronised control of all process-related parameters
• Individually configurable via process modules
• Comprehensive data and media logging and reporting functions
• Full access to the process and simple visual programming via touchscreen
• Numerous supported joining technologies (adhesive bonding, soldering, thermocompression, ultrasonic bonding)
• Sequence control with predefined parameters

The Fujifilm DMP-2850 is a drop-on-demand (DOD) inkjet printer designed for high-precision printing. It utilises the principle of piezoelectric DOD: a piezoelectric actuator triggers a pressure pulse, causing ink droplets to be ejected. The DMP-2850 can, for example, be used to print conductive metallic inks onto various surfaces for smart wearables.

The DMP-2850 features:

• a flat, heatable substrate table with electrically driven xyz adjustment, to which various substrates can be secured using a vacuum
• a Drop-Watcher for monitoring and analysing the drop-jetting system
• a fiducial camera for aligning the substrate and measuring the print points
• a cartridge cleaning station
• various piezo-driven print cartridges with integrated ink reservoirs and heating capability (16 print nozzles, up to 1.5 ml ink capacity, two droplet volumes: 10 or 1 pl)
• software for monitoring the print pattern, droplet parameters and other quality parameters.

• Manufacturer	Fujifilm
  Model	DMP-2850
  Location	C307-B

UNIPRINT GO3 is a third-generation desktop printing system featuring a camera-based alignment system and automatic stop function. This machine offers a range of capabilities, such as:

• A motorised squeegee with spring-loaded adjustable contact pressure, and precise vertical separation with a very finely adjustable release speed.
• The simple and precise readjustment of the table’s vertical position enables rapid changeover to different PCB thicknesses. The PCB support rails can be easily adjusted to the PCB thickness.
• This ensures that the PCB and squeegee contact surfaces remain precisely level throughout the printing stroke. This helps to extend the stencil’s service life.
• The machine is capable of printing small chip structures, BGAs, CSPs and other similarly fine structures.
• A pneumatic servo system for balancing the top frame helps to open and close the top frame with minimal effort. It is unaffected by the stencil clamping weight. The top frame can be operated with just the touch of a finger!

• Manufacturer	PBT-Uniprint
  Model	PMGo3V
  Location	C307

• Solder paste that has been stored in the cold can be prepared immediately without having to bring it back up to room temperature.
• Optimising the mixing formula makes it easy to adjust the viscosity and temperature of the solder paste.
• Removes large air bubbles from the paste, which are considered to be the cause of solder paste defects.
• Compatible with standard 500g solder paste containers without modification.
• Stirs and redisperses used solder paste.
• Supports solder paste in syringes through the use of the optional adapter.
• Maximum capacity: 680g (total mass for mounting on the beaker holder, including materials, container and adapter.)

• Manufacturer	THINKY
  Model	SR-500
  Location	C301

The Zepto from Diener Electronics is a low-pressure plasma etching system for cleaning, activating, etching and coating various material surfaces. Plasma etching can be carried out in a pure oxygen atmosphere or in an oxygen/argon atmosphere. The aim of the process is to activate material surfaces and remove unwanted organic deposits in order to prepare the surfaces for subsequent processes.

• Development of a conductive ink formulation and assessment of substrate suitability using various printed electronics technologies for a wide range of flexible electronics and LED interconnect applications.
• Design and development of smart wearables, such as low-cost, lightweight and flexible biosensors with a low carbon footprint.

The Mistral 260 is a small convection reflow oven with a conveyor belt and three heating zones. This oven is suitable for lead-free applications.

The RSS-160-S reflow soldering system is a highly compact and easy-to-use benchtop unit designed for use in laboratories and cleanrooms. The chamber is vacuum-tight and fitted with a viewing window, allowing visual monitoring of the soldering process. The unit is fitted as standard with a mass flow controller for the process gas.
The reflow soldering system is ideal for the following applications:

• Flux-free soldering
• Flip-chip processes
• Bonding
• Reflow solder bumps
• Encapsulation of housings
• Soldering of power devices
• Heat treatment of semiconductor wafers

• Manufacturers	Uni-Temp
  Model	RSS-160-S
  Location	C301