Research Group "Microelectronic Packaging"

Microelectronic systems and the associated packaging technology are the key technology of current and future mobility solutions. Increasing miniaturization of electronic systems combined with increasing performance and lifetime require the development of new reliable materials, improvement of existing assembly and interconnection techniques as well as the extension of existing analysis and test methods. The focus of our research is on applications in optoelectronics (LED modules) and power electronics.

Due to our close cooperation with various companies from the automotive industry, packaging and interconnection technology, optics manufacturers and many more in different research cooperations, we work very close to the application and always on the most current topics of microelectronics and packaging and interconnection technology. In addition, this enables our students to gain initial insights into possible professional fields in the aforementioned research areas.

Reliable operation of electronic systems over their lifetime is essential. This must be ensured, especially in the automotive sector with its high safety requirements. High operating temperatures and strong mechanical and thermomechanical stress influence the reliability of the systems and require advanced and reliable assembly and interconnection technologies.

Mobility in the future will be optimized in terms of energy efficiency and customer benefit. The major focus lies on: combustion and electric motors, power electronics, powertrain, energy storage, fuels, electrical consumers, energy networks and their interaction. In addition to innovative functional developments and operating strategies, the topics of networked mobility, Industry 4.0 and Smart Cities are increasingly being incorporated into the projects.

We in the research group "Microelectronic Packaging" headed by Prof. Dr. Gordon Elger build electronic systems and test them for reliability in our laboratories in accelerated aging tests (for example under temperature cycling conditions).

Using state-of-the-art methods (Raman spectroscopy, ultrasound, ...), we then analyze the tested components for failure patterns and failure mechanisms.

In addition to existing analysis methods, our research group is developing its own electrical test methods with which the reliability of electronic components can be measured non-destructively in-situ and ex-situ (Automated Transient Thermal Analysis).

Using finite element (FE) and computational fluid dynamics (CFD) methods, we simulate the physical relationships of electronic systems and can thus decisively optimize their thermal management, for example.

Our research group currently comprises around 7 scientific employees, who in turn are supported by numerous student employees, bachelor's and master's students. 

Packaging is a key technology for microelectronics manufacturing. Miniaturization of electrical systems with simultaneously increasing power demand improvement in interconnecting materials, interconnecting processes, and the thermal management. The Internet of Things (IoT) was and is only made possible by the innovations in assembly and connection technology. Also, in the automotive sector high operating temperatures under heavy mechanical and thermomechanical load, demand advanced and reliable interconnects. With ever-increasing requirements specially in case of safety and reliability,  the advanced microelectronic interconnects have prominent roles in driving the future.

This research group deals with the assembly and testing of electrical modules and systems. The focus of this team is on the applications for optoelectronics (LED modules) and power electronics. The key aspect for the electronic package is reliability, i.e. the faultless functioning over the longest possible service life. This research group develops nondestructive electrical test methods to study the reliability of the modules in accelerated aging tests. The reliability of solder joints is investigated at this laboratory as a function of solder metallurgy as well as the soldering process. This laboratory has developed an automated measuring system and an evaluation method to perform in-situ and ex-situ testings, with high sensitivity, on the mechanical integrity of electronic assemblies.

Because the temperature of the semiconductor affects the life-time of the semiconductors, thermal management has great importance for its reliability. Therefore, Transient Thermal Analysis (TTA) as a novel method has been used in this research group to investigate the thermal resistance in the electrical systems. Based on these measurements, finite element (FE) and computational fluid dynamics (CFD) models are created and validated. Simulations predict the temperature and optimize the design of the electronic systems.

Our research lab collaborates in a co-development mode with national and international companies in materials and test equipment development, processing, packaging and assembly techniques, and transferring both the new technologies and the educated engineers to provide a path for commercialization of the new technologies.

If you are interested in open positions for student work within the research group, please send an email with your resume to Gordon.Elger@thi.de