Prof. Dr. Gordon Elger
Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Project description
The aim of the project is to increase the temperature resistance and reliability of the electrical and mechanical connections (interconnects) in the assemblies.
- Improved SAC solders in terms of reliability and cost
- New materials to increase the reliability of electrical and mechanical contacts of surface mount components for use at higher temperatures
- Development and validation of finite element models for mechanical reliability (crack initiation and growth) for new materials
Project information
| Tasks THI | Packaging and interconnection technology, materials research and process development |
| Project partner | Conti Temic Microelectronics GmbH |
| Project sponsor | Research at UAS with Companies (FHprofUnt) , Federal Ministry of Education and Research |
| Project term | 10/01/2017 until 09/30/2020 |