Project description

The aim of the project is to increase the temperature resistance and reliability of the electrical and mechanical connections (interconnects) in the assemblies.

  • Improved SAC solders in terms of reliability and cost
  • New materials to increase the reliability of electrical and mechanical contacts of surface mount components for use at higher temperatures
  • Development and validation of finite element models for mechanical reliability (crack initiation and growth) for new materials 

 

Project information

Tasks THIPackaging and interconnection technology, materials research and process development
Project partnerConti Temic Microelectronics GmbH
Project sponsorResearch at UAS with Companies (FHprofUnt) , Federal Ministry of Education and Research 
Project term10/01/2017 until 09/30/2020

 

Contact

Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail: