Prof. Dr. Gordon Elger
Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Project description
The aim of the project is to develop materials and processes for sintering miniaturized interconnects for optoelectronics, which can be used for high power components such as LEDs and lasers, and meet the high automotive reliability requirements. The project consists of three main work packages:
- Sintering process and material development
- Qualification of interconnects by TTA/Rth measurements through development of pulsed/stochastic TTA
-
Reliability of the Sinter Interconnect
Project information
| Tasks THI | Packaging and interconnection technology, materials research and process development |
| Project partner | OSRAM Opto Semiconductors GmbH |
| Project sponsor | Research at UAS with Companies (FHprofUnt) , Federal Ministry of Education and Research |
| Project term | 07/01/2019 until 06/30/2022 |