Project description

The aim of the project is to develop materials and processes for sintering miniaturized interconnects for optoelectronics, which can be used for high power components such as LEDs and lasers, and meet the high automotive reliability requirements. The project consists of three main work packages:

  • Sintering process and material development
  • Qualification of interconnects by TTA/Rth measurements through development of pulsed/stochastic TTA
  • Reliability of the Sinter Interconnect


Project information

Tasks THIPackaging and interconnection technology, materials research and process development
Project partnerOSRAM Opto Semiconductors GmbH
Project sponsorResearch at UAS with Companies (FHprofUnt) , Federal Ministry of Education and Research
Project term07/01/2019 until 06/30/2022



Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to