Project description

  • Investigation of fluxless solder contacts for high-power automotive LEDs
  • Reliability investigation of wafer-level package LEDs under automotive conditions
  • Prototype development for "low-cost" adaptive headlight module


Project information

Tasks THILong-term reliability of high-power automotive LEDs
Project partnerLumileds
Project sponsorBundesministerium für Bildung und Forschung in der Förderlinie "Ingenieurnachwuchs 2014"
Project term11/01/2014 bis 04/30/2019



Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to