Prof. Dr. Gordon Elger

Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology

Room: A114
Subject Area: Electronic and it‘s Manufacturing Technologies
Faculty: Fakultät E



  • Since 2016 Research Professor Assembly and Connection Technology
  • Since 2013 at THI
  • 1999 - 2002, Fraunhofer Institut for Reliability and Microintegration, Scientific Coworker
  • 2002 - 2004, Hymite GmbH Berlin, Teamleader Microelectronic Packaging
  • 2005 - 2007, Electrolux Italy, R&D Manager CAE (Structural Analysis and Heatmanagement)
  • PhD, Free University of Berlin
  • Physics studies, Free University of Berlin


  • Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks, A. Zippelius, A. Hanß, M. Schmid, J. Perez-Velazquez, G. Elger, Microelectronics Reliability 129 (2022) 114461,
  • Die-attach bonding with etched micro brass metal pigment flakes for high power electronics packaging, S. K. Bhogaraju, H. R. Kotadia, F. Conti, A. Mauser, T. Rubenbauer, R. Bruetting, M. Schneider-Ramelow, G. Elger, ACS Applied Electronic Materials, 2021, Article ASAP, DOI: 10.1021/acsaelm.1c00721
  • Predictive maintenance enabled by machine learning: Use cases and challenges in the automotive industry, A. Theissler, J. Perez-Velazquez, M. Kettelgerdes, G. Elger, Reliability Engineering & System Safety, 2021, 215(19):107864, DOI:10.1016/j.ress.2021.107864
  • Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics, M. Schmid, S. K. Bhogaraju, E Liu, G. Elger,  2020, Applied Sciences 10(23):8516, DOI: 10.3390/app10238516
  • Analysis of Thermomechanical Stress in GaN LEDs Soldered on Cu Substrate by Finite Element Method and RAMAN Spectroscopy, E Liu, F. Conti , S.K. Bhogarajua, R. Signorini, D. Pedron, B. Wunderle, G. Elger, Journal of Raman Spectroscopy 2020;1–12, DOI: 10.1002/jrs.5947

Awards and memberships

  • Member of International Microelectronics and Packaging Society (IMAPS)