Packaging and interconnection technology is a key technology for microelectronics. Miniaturization of electrical systems with simultaneously increasing performance under high cost pressure poses a growing challenge to materials, connection processes, mechanical and electrical contacts (soldering, bonding, sintering) and thermal management. The Internet of Things (IoT) was and is only made possible by innovations in packaging and interconnection technology.

The Internet of Things (IoT) was and is only made possible by innovations in packaging and interconnection technology. Also in the automotive sector at high operating temperatures under strong mechanical and thermo-mechanical stress, the demands on PIT are particularly high. As the density of electronics in the vehicle continues to increase - also in the safety-relevant area - PIT has an outstanding role to play in the reliability and safety of mobility in the 21st century. The Laboratory for Packaging and Interconnection Technology deals with the realization of solder, sinter and adhesive connections in the field of SMD technology.  Climate, temperature and shock chambers are used for accelerated aging tests. Cross sections, scanning electron microscopy, pull/shear tests can be carried out for analysis at the university.

Currently, an FH investment application for a clean room with wire and die bonder for prototyping and small series production of compact power electronics modules for electric mobility is underway.