Equipment description

The Fineplacer Sigma as a semi-automatic bonder offers a future-proof assembly and development platform with almost unlimited application possibilities.

  • Max. Force = 1000N
  • Min. Force = 0.1N
  • Component size: 0.5mm2 up to 25mm2
  • Sintering under nitrogen, formic acid enriched nitrogen possible
  • Tmax = 400°C
  • Placement accuracy better than 1µm
  • In-situ process monitoring in HD
  • UHD Vision Alignment System with FPXvisionTM
  • Modular machine platform enables on-site retrofitting over the entire service life
  • Wide range of supported component presentations (Wafer, Waffle Pack, Gel-Pak®)
  • Integrated Die Picking Module
  • Synchronized control of all process-related parameters
  • Individually configurable through process modules
  • Extensive data/media logging and reporting capability
  • Full access to the process and easy visual programming with touch screen
  • Numerous supported joining technologies (gluing, soldering, thermo-compression, ultrasound)
  • Sequence control with predefined parameters

 

Equipment information

ManufacturerFineplacer
ModelSigma
LocationC307B
ContactDipl. Ing. (FH) Kirsten Windhorn-Witt

 

Laboratory Engineer

Lab engineer
Dipl. Ing. (FH) Kirsten Windhorn-Witt
Phone: +49 841 9348-2844
Room: C307
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to assistenz-iimo-elger.de.