Project description

  • Normalization of measurement or analysis methods between two countries
  • Standardization of k-factor free transient thermal analysis

 

Project information

Tasks THIDevelopment of measurement technology
Project partnerChinese Academic of Science
Project sponsorFörderprogramm Projektbezogener Wissenschaftleraustausch (proWA)
Project term2015 until 2017

 

Contact

Head of Research Group Microelectronics Packaging
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to gordon.elger@thi.de.