Our research lab collaborates in a co-development mode with national and international companies in materials and test equipment development, processing, packaging and assembly techniques, and transferring both the new technologies and the educated engineers to provide a path for commercialization of the new technologies.

 

Research partner

ANYLINKBOSCHbudatec
CeramtecChinese Academy of Sciences

Continental

Fraunhofer IZMHella

Heraeus

LUMILEDSnano-join

Nanotest

Osaka University OSRAMSchlenk
SEMIKRONTechnische Universität Chemnitz

Technische Universität Berlin

Università Degli Studi Di Padova

Warwick Manufactoring Group -

Warwick University

XTPL
ZESTRON  

 

Contact

Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to gordon.elger@thi.de.

 

Quicklinks

Microelectronic Packaging