Prof. Dr. Gordon Elger

Leiter des Fraunhofer Anwendungszentrums "Vernetzte Mobilität und Infrastruktur"; Forschungsprofessor für Aufbau- und Verbindungstechnik

+49 841 9348-2840

Gordon.Elger@thi.de

Raum: A114

Lehrgebiet: Elektronik und deren Fertigungstechnik

Fakultät: Fakultät E

Forschung

Institut für Innovative Mobilität (IIMo), Forschungsgruppe "Microelectronic Packaging"
Leitung des Fraunhofer Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"

Vita

Seit 2016 Forschungsprofessor für "Aufbau- und Verbindungstechnik"
Seit 2013 an der THI
1999 - 2002, Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Wissenschaftlicher Mitarbeiter
2002 - 2004, Hymite GmbH Berlin, Gruppenleiter Microelectronic Packaging
2005 - 2007, Electrolux Italien, R&D Manager für CAE (Strukturanalyse und Wärmemanagement)
Dissertation, Freie Universität Berlin
Physikstudium, Freie Universität Berlin

Auszeichnungen und Mitgliedschaften

Mitglied bei International Microelectronics and Packaging Society (IMAPS)

Publikationen

2026

MOHAN, Nihesh, Nicola BALLIN, Fosca CONTI und Gordon ELGER, 2026. In-situ formation of copper nanoparticles using organometallic copper(II) formate-amine complexes. Materials Today Advances, 2026(30), 100829. ISSN 2590-0498. Verfügbar unter: https://doi.org/10.1016/j.mtadv.2026.100829

PANDEY, Amit, Zubair Akhtar MOHD, Nandana Kappuva VEETTIL, Bernhard WUNDERLE und Gordon ELGER, 2026. Quantitative Kernel estimation from traffic signs using slanted edge spatial frequency response as a sharpness metric. Scientific Reports, 16(1), 7387. ISSN 2045-2322. Verfügbar unter: https://doi.org/10.1038/s41598-026-40556-w

2025

MOHAN, Nihesh, Fabian STEINBERGER, Sonja WÄCHTER, Hüseyin ERDOGAN und Gordon ELGER, 2025. Additive Manufacturing for Automotive Radar Sensors Using Copper Inks and Pastes. Applied Sciences, 15(5), 2676. ISSN 2076-3417. Verfügbar unter: https://doi.org/10.3390/app15052676

MOHD, Zubair Akhtar, Maximilian SCHMID und Gordon ELGER, 2025. AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data. Scientific Reports, 15, 24340. ISSN 2045-2322. Verfügbar unter: https://doi.org/10.1038/s41598-025-06902-0

HAN, Longfei, Qiuyu XU, Klaus KEFFERPÜTZ, Gordon ELGER und Jürgen BEYERER, 2025. Applying Extended Object Tracking for Self-Localization of Roadside Radar Sensors. 2024 IEEE 27th International Conference on Intelligent Transportation Systems (ITSC). Piscataway: IEEE, S. 2152-2158. ISBN 979-8-3315-0592-9. Verfügbar unter: https://doi.org/10.1109/ITSC58415.2024.10920198

ZIPPELIUS, Andreas, Zubair Akhtar MOHD, Maximilian SCHMID und Gordon ELGER, 2025. Comparison of different Input data for the prediction of LED solder joints using Artificial Neural Networks. IEEE Transactions on Device and Materials Reliability, 26(1), 157-166. ISSN 1558-2574. Verfügbar unter: https://doi.org/10.1109/TDMR.2025.3633876

BHANDERI, Savankumar, Shiva AGRAWAL und Gordon ELGER, 2025. Deep segmentation of 3+1D radar point cloud for real-time roadside traffic user detection. Scientific Reports, 15, 38489. ISSN 2045-2322. Verfügbar unter: https://doi.org/10.1038/s41598-025-23019-6

PANDEY, Amit, Stephan KÜHN, Alexander WEIS, Bernhard WUNDERLE und Gordon ELGER, 2025. Evaluating optical performance degradation of automotive cameras under accelerated aging. Optics and Lasers in Engineering, 2026(196), 109396. ISSN 1873-0302. Verfügbar unter: https://doi.org/10.1016/j.optlaseng.2025.109396

YAN, Zhiran, Yutong XIN, S. Shyam SHENOI, Rui SONG und Gordon ELGER, 2025. Framework and Multi-modal Dataset for Roadwork Zone Detection and Geo-localization. 2025 IEEE Intelligent Vehicles Symposium (IV). Piscataway: IEEE, S. 1758-1765. ISBN 979-8-3315-3803-3. Verfügbar unter: https://doi.org/10.1109/IV64158.2025.11097496

AGRAWAL, Shiva, Savankumar BHANDERI und Gordon ELGER, 2025. Infra-3DRC-FusionNet: Deep Fusion of Roadside Mounted RGB Mono Camera and Three-Dimensional Automotive Radar for Traffic User Detection. Sensors, 25(11), 3422. ISSN 1424-8220. Verfügbar unter: https://doi.org/10.3390/s25113422

MOHAN, Nihesh, Juan Ignacio AHUIR-TORRES, Hiren R. KOTADIA und Gordon ELGER, 2025. Laser sintering of Cu particle-free inks for high-performance printed electronics. npj Flexible Electronics, 9(1), 18. ISSN 2397-4621. Verfügbar unter: https://doi.org/10.1038/s41528-025-00389-5

ZIPPELIUS, Andreas, Elias HUFNAGEL, Jainam SHAH, Maximilian SCHMID und Gordon ELGER, 2025. Reliability of High-Power LEDs Under Varying Thermal Aging Conditions. 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 979-8-3315-9486-2. Verfügbar unter: https://doi.org/10.1109/THERMINIC65879.2025.11216869

SCHWAN, Hannes, Nihesh MOHAN, Maximilian SCHMID, Rocky Kumar SAHA, Holger KLASSEN, Klaus MÜLLER und Gordon ELGER, 2025. Sintering for High Power Optoelectronic Devices. Micromachines, 16(10), 1164. ISSN 2072-666X. Verfügbar unter: https://doi.org/10.3390/mi16101164

2024

KETTELGERDES, Marcel, Amit PANDEY, Denis UNRUH, Hüseyin ERDOGAN, Bernhard WUNDERLE und Gordon ELGER, 2024. Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN). 2023 29th International Conference on Mechatronics and Machine Vision in Practice (M2VIP). Piscataway: IEEE. ISBN 979-8-3503-2562-1. Verfügbar unter: https://doi.org/10.1109/M2VIP58386.2023.10413394

MOHAN, Nihesh, Juan Ignacio AHUIR-TORRES, Sri Krishna BHOGARAJU, Ralf WEBLER, Hiren R. KOTADIA, Hüseyin ERDOGAN und Gordon ELGER, 2024. Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks. New Journal of Chemistry, 48(15), 6796-6808. ISSN 1369-9261. Verfügbar unter: https://doi.org/10.1039/D3NJ05185D

OLCAY, Ertug, Henri MEESS und Gordon ELGER, 2024. Dynamic Obstacle Avoidance for UAVs using MPC and GP-Based Motion Forecast. 2024 European Control Conference (ECC). Piscataway: IEEE, S. 1024-1031. ISBN 978-3-9071-4410-7. Verfügbar unter: https://doi.org/10.23919/ECC64448.2024.10591083

MEESS, Henri, Jeremias GERNER, Daniel HEIN, Stefanie SCHMIDTNER, Gordon ELGER und Klaus BOGENBERGER, 2024. First steps towards real-world traffic signal control optimisation by reinforcement learning. Journal of Simulation, 18(6), 957-972. ISSN 1747-7778. Verfügbar unter: https://doi.org/10.1080/17477778.2024.2364715

HAN, Longfei, Klaus KEFFERPÜTZ, Gordon ELGER und Jürgen BEYERER, 2024. FlexSense: Flexible Infrastructure Sensors for Traffic Perception. 2023 IEEE 26th International Conference on Intelligent Transportation Systems (ITSC). Piscataway: IEEE, S. 3810-3816. ISBN 979-8-3503-9946-2. Verfügbar unter: https://doi.org/10.1109/ITSC57777.2023.10422616

MOHD, Zubair Akhtar, Christian KREINER, Maximilian SCHMID, Andreas ZIPPELIUS, Ulrich TETZLAFF und Gordon ELGER, 2024. Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to Improve SAC Solder Reliability Analysis. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Verfügbar unter: https://doi.org/10.1109/ESTC60143.2024.10712023

ELGER, Gordon, Sri Krishna BHOGARAJU und Martin SCHNEIDER-RAMELOW, 2024. Hybrid Cu sinter paste for low temperature bonding of bare semiconductors. Materials Letters, 2024(372), 136973. ISSN 1873-4979. Verfügbar unter: https://doi.org/10.1016/j.matlet.2024.136973

SCHWAN, Hannes, Maximilian SCHMID und Gordon ELGER, 2024. Layer Resolved Thermal Impedance Measurement with Laser Stimulated Transient Thermal Analysis of Semiconductor Modules. THERMINIC 2024: Proceedings of 2024, 30th International Workshop on Thermal Investigations of ICs and Systems. Piscataway: IEEE. ISBN 979-8-3503-8782-7. Verfügbar unter: https://doi.org/10.1109/THERMINIC62015.2024.10732233

MOHD, Zubair Akhtar, Maximilian SCHMID, Andreas ZIPPELIUS und Gordon ELGER, 2024. LEDs Lifetime Prediction Modeling: Thermomechanical Simulation for SAC305 and SAC105. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 979-8-3503-9363-7. Verfügbar unter: https://doi.org/10.1109/EuroSimE60745.2024.10491530

STEINBERGER, Fabian, Nihesh MOHAN, Olaf RÄMER und Gordon ELGER, 2024. Low temperature die-attach bonding using copper particle free inks. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Verfügbar unter: https://doi.org/10.1109/ESTC60143.2024.10712150

BHOGARAJU, Sri Krishna, Nihesh MOHAN, Fabian STEINBERGER, Hüseyin ERDOGAN, Philipp HADRAVA und Gordon ELGER, 2024. Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Verfügbar unter: https://doi.org/10.23919/EMPC55870.2023.10418277

KETTELGERDES, Marcel, Nicolas SARMIENTO, Hüseyin ERDOGAN, Bernhard WUNDERLE und Gordon ELGER, 2024. Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors. Remote Sensing, 16(13), 2407. ISSN 2072-4292. Verfügbar unter: https://doi.org/10.3390/rs16132407

MOHAN, Nihesh, Juan Ignacio AHUIR-TORRES, Sri Krishna BHOGARAJU, Hiren R. KOTADIA und Gordon ELGER, 2024. Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Verfügbar unter: https://doi.org/10.23919/EMPC55870.2023.10418323

BHOGARAJU, Sri Krishna, Francesco UGOLINI, Federico BELPONER, Alessio GRECI und Gordon ELGER, 2024. Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Verfügbar unter: https://doi.org/10.23919/EMPC55870.2023.10418348

HAN, Longfei, Qiuyu XU, Klaus KEFFERPÜTZ, Ying LU, Gordon ELGER und Jürgen BEYERER, 2024. Scalable Radar-based Roadside Perception: Self-localization and Occupancy Heat Map for Traffic Analysis. 2024 IEEE Intelligent Vehicles Symposium (IV). Piscataway: IEEE, S. 1651-1657. ISBN 979-8-3503-4881-1. Verfügbar unter: https://doi.org/10.1109/iv55156.2024.10588397

AGRAWAL, Shiva, Savankumar BHANDERI und Gordon ELGER, 2024. Semi-Automatic Annotation of 3D Radar and Camera for Smart Infrastructure-Based Perception. IEEE Access, 12, 34325-34341. ISSN 2169-3536. Verfügbar unter: https://doi.org/10.1109/ACCESS.2024.3373310

MOHD, Zubair Akhtar, Maximilian SCHMID, Andreas ZIPPELIUS und Gordon ELGER, 2024. Solder joint lifetime model using AI framework operating on FEA data. Engineering Failure Analysis, 2025(167), 109032. ISSN 1350-6307. Verfügbar unter: https://doi.org/10.1016/j.engfailanal.2024.109032

PARET, Paul, Sri Krishna BHOGARAJU, Dirk BUSSE, Alexander DAHLBÜDDING, Gordon ELGER und Sreekant NARUMANCHI, 2024. Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock. Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Piscataway: IEEE, S. 1219-1224. ISBN 979-8-3503-7598-5. Verfügbar unter: https://doi.org/10.1109/ECTC51529.2024.00196

AHUIR-TORRES, Juan Ignacio, Sri Krishna BHOGARAJU, Geoff WEST, Gordon ELGER und Hiren R. KOTADIA, 2024. Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Verfügbar unter: https://doi.org/10.23919/EMPC55870.2023.10418365

LIU, E, Zubair Akhtar MOHD, Fabian STEINBERGER, Bernhard WUNDERLE und Gordon ELGER, 2024. Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Verfügbar unter: https://doi.org10.1109/ESTC60143.2024.10712149

2023

KETTELGERDES, Marcel, Tjorven HILLMANN, Thomas HIRMER, Hüseyin ERDOGAN, Bernhard WUNDERLE und Gordon ELGER, 2023. Accelerated Real-Life (ARL) Testing and Characterization of Automotive LiDAR Sensors to facilitate the Development and Validation of Enhanced Sensor Models [Preprint]. arXiv. Verfügbar unter: https://doi.org/10.48550/arXiv.2312.04229

STEINBERGER, Fabian, Sri Krishna BHOGARAJU und Gordon ELGER, 2023. Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques. NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers. Piscataway: IEEE. ISBN 978-91-89821-06-4. Verfügbar unter: https://doi.org/10.23919/NordPac58023.2023.10186250

PANDEY, Amit, Denis UNRUH, Marcel KETTELGERDES, Bernhard WUNDERLE und Gordon ELGER, 2023. Evaluation of thermally-induced change in sharpness of automotive cameras by coupled thermo-mechanical and optical simulation. In: MATOBA, Osamu, Joseph A. SHAW und Christopher R. VALENTA, Hrsg. SPIE Future Sensing Technologies 2023. Bellingham: SPIE. ISBN 978-1-5106-5723-6. Verfügbar unter: https://doi.org/10.1117/12.2665475

KETTELGERDES, Marcel und Gordon ELGER, 2023. In-Field Measurement and Methodology for Modeling and Validation of Precipitation Effects on Solid-State LiDAR Sensors. IEEE Journal of Radio Frequency Identification, 7, 192-202. ISSN 2469-7281. Verfügbar unter: https://doi.org/10.1109/JRFID.2023.3234999

AGRAWAL, Shiva, Savankumar BHANDERI, Sumit AMANAGI, Kristina DOYCHEVA und Gordon ELGER, 2023. Instance Segmentation and Detection of Children to Safeguard Vulnerable Traffic User by Infrastructure. In: VINEL, Alexey, Jeroen PLOEG, Karsten BERNS und Oleg GUSIKHIN, Hrsg. Proceedings of the 9th International Conference on Vehicle Technology and Intelligent Transport Systems. Setúbal: SciTePress, S. 206-214. ISBN 978-989-758-652-1. Verfügbar unter: https://doi.org/10.5220/0011825400003479

AGRAWAL, Shiva, Rui SONG, Kristina DOYCHEVA, Alois KNOLL und Gordon ELGER, 2023. Intelligent Roadside Infrastructure for Connected Mobility. In: KLEIN, Cornel, Matthias JARKE, Jeroen PLOEG, Markus HELFERT, Karsten BERNS und Oleg GUSIKHIN, Hrsg. Smart Cities, Green Technologies, and Intelligent Transport Systems: 11th International Conference, SMARTGREENS 2022 and 8th International Conference, VEHITS 2022: Revised Selected Papers. Cham: Springer, S. 134-157. ISBN 978-3-031-37470-8. Verfügbar unter: https://doi.org/10.1007/978-3-031-37470-8_6

SCHMID, Maximilian, Andreas ZIPPELIUS, Alexander HANSS, Stephan BÖCKHORST und Gordon ELGER, 2023. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II - Reliability. IEEE Transactions on Device and Materials Reliability, 23(3), 419-429. ISSN 1558-2574. Verfügbar unter: https://doi.org/10.1109/TDMR.2023.3300355

SENEL, Numan, Klaus KEFFERPÜTZ, Kristina DOYCHEVA und Gordon ELGER, 2023. Multi-Sensor Data Fusion for Real-Time Multi-Object Tracking. Processes, 11(2), 501. ISSN 2227-9717. Verfügbar unter: https://doi.org/10.3390/pr11020501

KETTELGERDES, Marcel, Peter MEZMER, Michael J. HAEUSSLER, Gunnar BÖTTGER, Majid TAVAKOLIBASTI, Amit PANDEY, Hüseyin ERDOGAN, Gordon ELGER, Ralph SCHACHT und Bernhard WUNDERLE, 2023. Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate. Proceedings: IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Piscataway: IEEE, S. 753-760. ISBN 979-8-3503-3498-2. Verfügbar unter: https://doi.org/10.1109/ECTC51909.2023.00131

AGRAWAL, Shiva, Savankumar BHANDERI, Kristina DOYCHEVA und Gordon ELGER, 2023. Static multi-target-based auto-calibration of RGB cameras, 3D Radar, and 3D Lidar sensors. IEEE Sensors Journal, 23(18), 21493-21505. ISSN 1530-437X. Verfügbar unter: https://doi.org/10.1109/JSEN.2023.3300957

SCHMID, Maximilian, Marcel MOMBERG, Marcel KETTELGERDES und Gordon ELGER, 2023. Transient thermal analysis for VCSEL Diodes. 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 979-8-3503-1862-3. Verfügbar unter: https://doi.org/10.1109/THERMINIC60375.2023.10325906

2022

PANDEY, Amit, Sri Krishna BHOGARAJU, Kerstin LUX und Gordon ELGER, 2022. Analysis of stress in spherically bent thinned image sensors. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE. ISBN 978-1-6654-5836-8. Verfügbar unter: https://doi.org/10.1109/EuroSimE54907.2022.9758847

STRECK, Egor, Reinhold HERSCHEL, Patrick WALLRATH, M. SUNDERAM und Gordon ELGER, 2022. Comparison of Two Different Radar Concepts for Pedestrian Protection on Bus Stops. In: PRASAD, Venkatesha, Dirk PESCH, Nirwan ANSARI und César BENAVENTE-PECES, Hrsg. Proceedings of the 11th International Conference on Sensor Networks. Setúbal: SciTePress, S. 89-96. ISBN 978-989-758-551-7. Verfügbar unter: https://doi.org/10.5220/0010777100003118

AGRAWAL, Shiva, Rui SONG, Akhil KOHLI, Andreas KORB, Maximilian ANDRE, Erik HOLZINGER und Gordon ELGER, 2022. Concept of Smart Infrastructure for Connected Vehicle Assist and Traffic Flow Optimization. In: PLOEG, Jeroen, Markus HELFERT, Karsten BERNS und Oleg GUSIKHIN, Hrsg. Proceedings of the 8th International Conference on Vehicle Technology and Intelligent Transport Systems. Setúbal: SciTePress, S. 360-367. ISBN 978-989-758-573-9. Verfügbar unter: https://doi.org/10.5220/0011068800003191

SCHMID, Maximilian, Joseph HERMANN, E LIU und Gordon ELGER, 2022. Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints. Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022. Piscataway: IEEE. ISBN 978-1-6654-8503-6. Verfügbar unter: https://doi.org/10.1109/iTherm54085.2022.9899664

HERMANN, Joseph, Maximilian SCHMID und Gordon ELGER, 2022. Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data. THERMINIC 2022: Proceedings 2022. Piscataway: IEEE. ISBN 978-1-6654-9229-4. Verfügbar unter: https://doi.org/10.1109/THERMINIC57263.2022.9950673

SACCON, Rodolfo, Alice BENIN, Sri Krishna BHOGARAJU und Gordon ELGER, 2022. Effect of binders on the performance of copper sintering pastes. 2022 International Conference on Electronics Packaging (ICEP 2022). Piscataway (NJ): IEEE, S. 71-72. ISBN 978-4-9911911-3-8. Verfügbar unter: https://doi.org/10.23919/ICEP55381.2022.9795555

MOHAN, Nihesh, Stefan LANGER und Gordon ELGER, 2022. Fluxfree solder paste and process for standard SMD components. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE, S. 163-168. ISBN 978-1-6654-8947-8. Verfügbar unter: https://doi.org/10.1109/ESTC55720.2022.9939528

LIU, E, Sri Krishna BHOGARAJU, Kerstin LUX, Gordon ELGER und Rokeya Mumtahana MOU, 2022. Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS). Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022. Piscataway: IEEE, S. 739-745. ISBN 978-1-6654-7943-1. Verfügbar unter: https://doi.org/10.1109/ECTC51906.2022.00123

LIU, E, Sri Krishna BHOGARAJU, Bernhard WUNDERLE und Gordon ELGER, 2022. Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy. Microelectronics Reliability, 2022(138), 114664. ISSN 0026-2714. Verfügbar unter: https://doi.org/10.1016/j.microrel.2022.114664

SCHMID, Maximilian, Andreas ZIPPELIUS, Alexander HANSS, Stephan BÖCKHORST und Gordon ELGER, 2022. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I - Initial Characterization. IEEE Transactions on Device and Materials Reliability, 22(2), 175-186. ISSN 1530-4388. Verfügbar unter: https://doi.org/10.1109/TDMR.2022.3152590

SCHWAN, Hannes, Maximilian SCHMID und Gordon ELGER, 2022. Laser Stimulated Transient Thermal Analysis of Semiconductors. THERMINIC 2022: Proceedings 2022. Piscataway: IEEE. ISBN 978-1-6654-9229-4. Verfügbar unter: https://doi.org/10.1109/THERMINIC57263.2022.9950672

BHOGARAJU, Sri Krishna, Maximilian SCHMID, E LIU, Rodolfo SACCON, Gordon ELGER, Holger KLASSEN, Klaus MÜLLER und Georg PIRZER, 2022. Low cost copper based sintered interconnect material for optoelectronics packaging. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Piscataway: IEEE, S. 1720-1725. ISBN 978-1-6654-7943-1. Verfügbar unter: https://doi.org/10.1109/ECTC51906.2022.00270

KETTELGERDES, Marcel und Gordon ELGER, 2022. Modeling Methodology and In-field Measurement Setup to Develop Empiric Weather Models for Solid-State LiDAR Sensors. 2022 IEEE 2nd International Conference on Digital Twins and Parallel Intelligence (DTPI). Piscataway: IEEE. ISBN 978-1-6654-9227-0. Verfügbar unter: https://doi.org/10.1109/DTPI55838.2022.9998918

ZIPPELIUS, Andreas, Tobias STROBL, Maximilian SCHMID, Joseph HERMANN, Alwin HOFFMANN und Gordon ELGER, 2022. Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE, S. 566-575. ISBN 978-1-6654-8947-8. Verfügbar unter: https://doi.org/10.1109/ESTC55720.2022.9939465

MEESS, Henri, Jeremias GERNER, Daniel HEIN, Stefanie SCHMIDTNER und Gordon ELGER, 2022. Real World Traffic Optimization by Reinforcement Learning: A Concept. In: KIEU, Minh Le, Koen H. van DAM, Jason THOMPSON, Nick MALLESON, Alison HEPPENSTALL und Jiaqi GE, Hrsg. International Workshop on Agent-Based Modelling of Urban Systems (ABMUS) Proceedings: 2022. [s. l.]: figshare, S. 49-54. Verfügbar unter: https://doi.org/10.6084/m9.figshare.19733800.v1

MEESS, Henri, Jeremias GERNER, Daniel HEIN, Stefanie SCHMIDTNER und Gordon ELGER, 2022. Reinforcement Learning for Traffic Signal Control Optimization: A Concept for Real-World Implementation. AAMAS '22: Proceedings of the 21st International Conference on Autonomous Agents and Multiagent Systems. Richland: International Foundation for Autonomous Agents and Multiagent Systems, S. 1699-1701. ISBN 978-1-4503-9213-6. Verfügbar unter: https://dl.acm.org/doi/10.5555/3535850.3536081

ZIPPELIUS, Andreas, Alexander HANSS, Maximilian SCHMID, Judith PÉREZ-VELÁZQUEZ und Gordon ELGER, 2022. Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks. Microelectronics Reliability, 2022(129), 114461. ISSN 0026-2714. Verfügbar unter: https://doi.org/10.1016/j.microrel.2021.114461

SCHMID, Maximilian, Joseph HERMANN, Sri Krishna BHOGARAJU und Gordon ELGER, 2022. Reliability of SAC Solders under Low and High Stress Conditions. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE, S. 553-559. ISBN 978-1-6654-8947-8. Verfügbar unter: https://doi.org/10.1109/ESTC55720.2022.9939394

TAVAKOLIBASTI, M., P. MESZMER, Marcel KETTELGERDES, Gunnar BÖTTGER, Gordon ELGER, Hüseyin ERDOGAN, A. SESHADITYA und Bernhard WUNDERLE, 2022. Structural-thermal-optical-performance (STOP) analysis of a lens stack for realization of a digital twin of an automotive LiDAR. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE. ISBN 978-1-6654-5836-8. Verfügbar unter: https://doi.org/10.1109/EuroSimE54907.2022.9758897

SCHWAN, Hannes, Johannes PFORR und Gordon ELGER, 2022. ZVS Class E2 Wireless Power Transfer System with Self-Resonant Transmission Coils for the Biomedical Application. In: MESAGO MESSE FRANKFURT GMBH,, Hrsg. PCIM Europe 2022: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Berlin: VDE Verlag. ISBN 978-3-8007-5822-7. Verfügbar unter: https://doi.org/10.30420/565822107

2021

SCHMID, Maximilian, Sri Krishna BHOGARAJU, Alexander HANSS und Gordon ELGER, 2021. A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition. IEEE Transactions on Instrumentation and Measurement, 70, 6500409. ISSN 0018-9456. Verfügbar unter: https://doi.org/10.1109/TIM.2020.3011818

LIU, E, Maximilian SCHMID, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Advanced location resolved transient thermal analysis. 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE, S. 191-196. ISBN 978-1-7281-7643-7. Verfügbar unter: https://doi.org/10.1109/THERMINIC49743.2020.9420538

SCHMID, Maximilian, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Characterization of copper sintered interconnects by transient thermal analysis. 2021 International Conference on Electronics Packaging (ICEP 2021). Piscataway: IEEE, S. 71-72. ISBN 978-4-9911-9111-4. Verfügbar unter: https://doi.org/10.23919/ICEP51988.2021.9451966

AGRAWAL, Shiva und Gordon ELGER, 2021. Concept of infrastructure based environment perception for IN2Lab test field for automated driving. 2021 IEEE International Smart Cities Conference (ISC2). Piscataway: IEEE. ISBN 978-1-6654-4919-9. Verfügbar unter: https://doi.org/10.1109/ISC253183.2021.9562894

KETTELGERDES, Marcel, Lena BÖHM und Gordon ELGER, 2021. Correlating Intrinsic Parameters and Sharpness for Condition Monitoring of Automotive Imaging Sensors. 2021 5th International Conference on System Reliability and Safety (ICSRS). Piscataway: IEEE, S. 298-306. ISBN 978-1-6654-0049-7. Verfügbar unter: https://doi.org/10.1109/ICSRS53853.2021.9660665

SCHMID, Maximilian, Sri Krishna BHOGARAJU, Andreas RIEDEL und Gordon ELGER, 2021. Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges. 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE, S. 268-273. ISBN 978-1-7281-7643-7. Verfügbar unter: https://doi.org/10.1109/THERMINIC49743.2020.9420493

BHOGARAJU, Sri Krishna, Hiren R. KOTADIA, Fosca CONTI, Armin MAUSER, Thomas RUBENBAUER, Robert BRUETTING, Martin SCHNEIDER-RAMELOW und Gordon ELGER, 2021. Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging. ACS Applied Electronic Materials, 3(10), 4587-4603. ISSN 2637-6113. Verfügbar unter: https://doi.org/10.1021/acsaelm.1c00721

MOHAN, Nihesh, Sri Krishna BHOGARAJU, Mateusz LYSIEN, Ludovic SCHNEIDER, Filip GRANEK, Kerstin LUX und Gordon ELGER, 2021. Drop feature optimization for fine trace inkjet printing. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers. Piscataway: IEEE. ISBN 978-0-9568086-7-7. Verfügbar unter: https://doi.org/10.23919/EMPC53418.2021.9585004

KLEINER, Jan, Alexander HEIDER, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2021. Experimental Study on the Thermal Interactions in Novel Intelligent Lithium-Ion Modules for Electric Vehicles. Proceedings of the Twentieth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2021. Piscataway: IEEE, S. 556-562. ISBN 978-1-7281-8539-2. Verfügbar unter: https://doi.org/10.1109/ITherm51669.2021.9503299

MOKHTARI, Omid, Fosca CONTI, Rodolfo SACCON, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure. New Journal of Chemistry, 45(43), 20133-20139. ISSN 1369-9261. Verfügbar unter: https://doi.org/10.1039/D1NJ02476K

BHOGARAJU, Sri Krishna, Maximilian SCHMID, Hiren R. KOTADIA, Fosca CONTI und Gordon ELGER, 2021. Highly reliable die-attach bonding with etched brass flakes. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers. Piscataway: IEEE. ISBN 978-0-9568086-7-7. Verfügbar unter: https://doi.org/10.23919/EMPC53418.2021.9584967

BHOGARAJU, Sri Krishna, Maximilian SCHMID, Elias HUFNAGEL, Fosca CONTI, Hiren R. KOTADIA und Gordon ELGER, 2021. Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste. IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings. Piscataway: IEEE, S. 526-531. ISBN 978-1-6654-4097-4. Verfügbar unter: https://doi.org/10.1109/ECTC32696.2021.00094

PASCUCCI, Jacopo, Fosca CONTI, Sri Krishna BHOGARAJU, Raffaella SIGNORINI, E LIU, Danilo PEDRON und Gordon ELGER, 2021. Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates. In: CHEBEN, Pavel, Jiří ČTYROKÝ und Iñigo MOLINA-FERNÁNDEZ, Hrsg. Integrated Optics: Design, Devices, Systems and Applications VI. Bellingham: SPIE. ISBN 978-1-5106-4385-7. Verfügbar unter: https://doi.org/10.1117/12.2576414

THEISSLER, Andreas, Judith PÉREZ-VELÁZQUEZ, Marcel KETTELGERDES und Gordon ELGER, 2021. Predictive maintenance enabled by machine learning: use cases and challenges in the automotive industry. Reliability Engineering & System Safety, 2021(215), 107864. ISSN 0951-8320. Verfügbar unter: https://doi.org/10.1016/j.ress.2021.107864

THEISSLER, Andreas, Judith PÉREZ-VELÁZQUEZ, Marcel KETTELGERDES und Gordon ELGER, 2021. Predictive maintenance enabled by machine learning: Use cases and challenges in the automotive industry. Reliability Engineering & System Safety, 2021(215), 107864. ISSN 0951-8320. Verfügbar unter: https://doi.org/10.1016/j.ress.2021.107864

CONTI, Fosca, Kerstin LUX, Sri Krishna BHOGARAJU, E LIU, Christoph LENZ, Roland SEITZ und Gordon ELGER, 2021. Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates. In: BALDINI, Francesco, Jiri HOMOLA und Robert A. LIEBERMAN, Hrsg. Optical Sensors 2021. Bellingham: SPIE. ISBN 978-1-5106-4379-6. Verfügbar unter: https://doi.org/10.1117/12.2591947

STRECK, Egor, Peter SCHMOK, Klaus SCHNEIDER, Hüseyin ERDOGAN und Gordon ELGER, 2021. Safeguarding future autonomous traffic by infrastructure based on multi radar sensor systems. FISITA World Congress 2021. Bishops Stortford: FISITA. Verfügbar unter: https://www.fisita.com/library/f2021-acm-121

SENEL, Numan, Shrivatsa UDUPA und Gordon ELGER, 2021. Sensor data preprocessing in road-side sensor units. FISITA World Congress 2021. Bishops Stortford: FISITA. Verfügbar unter: https://www.fisita.com/library/f2021-acm-120

LIU, E, Fosca CONTI, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-6654-1373-2. Verfügbar unter: https://doi.org/10.1109/EuroSimE52062.2021.9410869

CONTI, Fosca, E LIU, Sri Krishna BHOGARAJU, Christoph LENZ, Roland SEITZ und Gordon ELGER, 2021. Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering. 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE, S. 204-208. ISBN 978-1-7281-7643-7. Verfügbar unter: https://doi.org/10.1109/THERMINIC49743.2020.9420523

KLEINER, Jan, Lorenz LECHERMANN, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2021. Thermal behavior of intelligent automotive lithium-ion batteries: operating strategies for adaptive thermal balancing by reconfiguration. Journal of energy storage, 2021(40), 102686. ISSN 2352-1538. Verfügbar unter: https://doi.org/10.1016/j.est.2021.102686

KLEINER, Jan, Alexander HEIDER, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2021. Thermal behavior of intelligent automotive lithium-ion batteries: Experimental study with switchable cells and reconfigurable modules. Journal of Energy Storage, 2021(44), 103274. ISSN 2352-1538. Verfügbar unter: https://doi.org/10.1016/j.est.2021.103274

TAVAKOLIBASTI, M., P. MESZMER, Gunnar BÖTTGER, Marcel KETTELGERDES, Gordon ELGER, Hüseyin ERDOGAN, A. SESHADITYA und Bernhard WUNDERLE, 2021. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-6654-1373-2. Verfügbar unter: https://doi.org/10.1109/EuroSimE52062.2021.9410831

2020

ELGER, Gordon, Omid MOKHTARI, Sri Krishna BHOGARAJU, Fosca CONTI, Markus MEIER und Helmut SCHWEIGART, 2020. Analyse der Reaktionsprodukte von Metall-Formiaten im rückstandfreien Lötprozess. GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten. Berlin: VDE Verlag. ISBN 978-3-8007-5185-3. Verfügbar unter: https://www.vde-verlag.de/proceedings-de/455185053.html

KÜHN, Stephan, Amit PANDEY, Andreas ZIPPELIUS, Klaus SCHNEIDER, Hüseyin ERDOGAN und Gordon ELGER, 2020. Analysis of package design of optic modules for automotive cameras to realize reliable image sharpness. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-7281-6293-5. Verfügbar unter: https://doi.org/10.1109/ESTC48849.2020.9229786

ZIPPELIUS, Andreas, Alexander HANSS, E LIU, Maximilian SCHMID, Judith PÉREZ-VELÁZQUEZ und Gordon ELGER, 2020. Comparing prediction methods for LED failure measured with Transient Thermal Analysis. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-7281-6049-8. Verfügbar unter: https://doi.org/10.1109/EuroSimE48426.2020.9152657

SCHMID, Maximilian, Sri Krishna BHOGARAJU, E LIU und Gordon ELGER, 2020. Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics. Applied Sciences, 10(23), 8516. ISSN 2076-3417. Verfügbar unter: https://doi.org/10.3390/app10238516

BHOGARAJU, Sri Krishna, Fosca CONTI und Gordon ELGER, 2020. Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-7281-6293-5. Verfügbar unter: https://doi.org/10.1109/ESTC48849.2020.9229801

BHOGARAJU, Sri Krishna, Fosca CONTI, Maximilian SCHMID, Markus MEIER, Helmut SCHWEIGART und Gordon ELGER, 2020. Development of sinter paste with surface modified copper alloy particles for die-attach bonding. ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems. Berlin: VDE Verlag, S. 582-587. ISBN 978-3-8007-5226-3. Verfügbar unter: https://www.vde-verlag.de/proceedings-de/455225100.html

BHOGARAJU, Sri Krishna, Omid MOKHTARI, Fosca CONTI und Gordon ELGER, 2020. Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol. Scripta Materialia, 2020(182), 74-80. ISSN 1359-6462. Verfügbar unter: https://doi.org/10.1016/j.scriptamat.2020.02.045

PANDEY, Amit, Stephan KÜHN, Hüseyin ERDOGAN, Klaus SCHNEIDER und Gordon ELGER, 2020. Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-7281-6049-8. Verfügbar unter: https://doi.org/10.1109/EuroSimE48426.2020.9152716

CONTI, Fosca, E LIU, Sri Krishna BHOGARAJU, Bernhard WUNDERLE und Gordon ELGER, 2020. Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-7281-6293-5. Verfügbar unter: https://doi.org/10.1109/ESTC48849.2020.9229843

BHOGARAJU, Sri Krishna, Omid MOKHTARI, Jacopo PASCUCCI, Alexander HANSS, Maximilian SCHMID, Fosca CONTI und Gordon ELGER, 2020. Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging. Proceedings 22nd European Microelectronics and Packaging Conference, EMPC. Piscataway: IEEE. ISBN 978-1-7281-6291-1. Verfügbar unter: https://doi.org/10.23919/EMPC44848.2019.8951887

KLEINER, Jan, Randeep SINGH, Michael SCHMID, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2020. Influence of heat pipe assisted terminal cooling on the thermal behavior of a large prismatic lithium-ion cell during fast charging in electric vehicles. Applied Thermal Engineering, 2021(188), 116328. ISSN 1359-4311. Verfügbar unter: https://doi.org/10.1016/j.applthermaleng.2020.116328

BHOGARAJU, Sri Krishna, Fosca CONTI, Hiren R. KOTADIA, Simon KEIM, Ulrich TETZLAFF und Gordon ELGER, 2020. Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging. Journal of Alloys and Compounds, 2020(844), 156043. ISSN 1873-4669. Verfügbar unter: https://doi.org/10.1016/j.jallcom.2020.156043

SENEL, Numan, Gordon ELGER und Andreas FESTAG, 2020. Sensor Time Synchronization in Smart Road Infrastructure. FISITA Web Congress 2020. Bishops Stortford: FISITA. Verfügbar unter: https://www.fisita.com/library/f2020-acm-083

DA ROSA ZANATTA, Mateus, Joao Paulo CARVALHO LUSTOSA DA COSTA, Felix ANTREICH, Martin HAARDT, Gordon ELGER, Fábio Lúcio LOPES DE MENDONÇA und Rafael Timóteo DE SOUSA JUNIOR, 2020. Tensor-based framework with model order selection and high accuracy factor decomposition for time-delay estimation in dynamic multipath scenarios. IEEE Access, 8, 174931-174942. ISSN 2169-3536. Verfügbar unter: https://doi.org/10.1109/ACCESS.2020.3024597

KEIM, Simon, Ulrich TETZLAFF und Gordon ELGER, 2020. The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content. Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Piscataway: IEEE, S. 2005-2012. ISBN 978-1-7281-6180-8. Verfügbar unter: https://doi.org/10.1109/ECTC32862.2020.00312

KLEINER, Jan, Alexander HEIDER, Christian HANZL, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2020. Thermal behavior of an intelligent li-ion cell under vehicle conditions. Proceedings: IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society. Piscataway: IEEE, S. 2081-2086. ISBN 978-1-7281-5414-5. Verfügbar unter: https://doi.org/10.1109/IECON43393.2020.9254336

LIU, E, Fosca CONTI, Sri Krishna BHOGARAJU, Raffaella SIGNORINI, Danilo PEDRON, Bernhard WUNDERLE und Gordon ELGER, 2020. Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy. Journal of Raman Spectroscopy, 51(10), 2083-2094. ISSN 1097-4555. Verfügbar unter: https://doi.org/10.1002/jrs.5947

2019

BHOGARAJU, Sri Krishna, Omid MOKHTARI, Jacopo PASCUCCI, Fosca CONTI, Hiren R. KOTADIA und Gordon ELGER, 2019. A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization. International Symposium on Microelectronics. Pittsburgh: IMAPS, S. 387-392. Verfügbar unter: https://doi.org/10.4071/2380-4505-2019.1.000387

SCHMID, Maximilian, Sri Krishna BHOGARAJU und Gordon ELGER, 2019. Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). Piscataway: IEEE, S. 2324-2330. ISBN 978-1-7281-1499-6. Verfügbar unter: https://doi.org/10.1109/ECTC.2019.00320

MOKHTARI, Omid, Fosca CONTI, Sri Krishna BHOGARAJU, Markus MEIER, Helmut SCHWEIGART, Ulrich TETZLAFF und Gordon ELGER, 2019. Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor. New Journal of Chemistry, 43(26), 10227-10231. ISSN 1369-9261. Verfügbar unter: https://doi.org/10.1039/C9NJ02135C

HANSS, Alexander, Maximilian SCHMID und Gordon ELGER, 2019. Combined Accelerated Stress Test with In-Situ Thermal Impedance Monitoring to Access LED Reliability. Proceedings 2018 20th International Conference on Electronic Materials and Packaging (EMAP). Piscataway: IEEE. ISBN 978-1-5386-5642-6. Verfügbar unter: https://doi.org/10.1109/EMAP.2018.8660833

HANSS, Alexander, E LIU, Muhammad Rizwan ABDULLAH und Gordon ELGER, 2019. Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-5386-8040-7. Verfügbar unter: https://doi.org/10.1109/EuroSimE.2019.8724558

BHOGARAJU, Sri Krishna, Omid MOKHTARI, Jacopo PASCUCCI, Fosca CONTI und Gordon ELGER, 2019. Improved sinterability of particles to substrates by surface modifications on substrate metallization. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). Pittsburgh (PA): IMAPS, S. 66-70. Verfügbar unter: https://doi.org/10.4071/2380-4491.2019.HiTen.000066

BRUGNOLOTTO, Enrico, Sri Krishna BHOGARAJU, E LIU, Fosca CONTI, Danilo PEDRON, Raffaella SIGNORINI und Gordon ELGER, 2019. Investigation of thermomechanical local stress induced in assembled GaN LEDs. 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-7281-2078-2. Verfügbar unter: https://doi.org/10.1109/THERMINIC.2019.8923629

KLEINER, Jan, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2019. Modelling of 3D temperature behavior of prismatic lithium-ion cell with focus on experimental validation under battery electric vehicle conditions. 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-7281-2078-2. Verfügbar unter: https://doi.org/10.1109/THERMINIC.2019.8923604

ELGER, Gordon, E LIU, Fosca CONTI, Raffaella SIGNORINI, Enrico BRUGNOLOTTO und Sri Krishna BHOGARAJU, 2019. Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-5386-8040-7. Verfügbar unter: https://doi.org/10.1109/EuroSimE.2019.8724533

KLEINER, Jan, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2019. Thermal modelling of a prismatic lithium-ion cell in a battery electric vehicle environment: influences of the experimental validation setup. Energies, 13(1), 62. ISSN 1996-1073. Verfügbar unter: https://doi.org/10.3390/en13010062

SIGNORINI, Raffaella, Fosca CONTI, Enrico BRUGNOLOTTO, Danilo PEDRON, E LIU, Sri Krishna BHOGARAJU und Gordon ELGER, 2019. Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy. In: CHEBEN, Pavel, Jiří ČTYROKÝ und Iñigo MOLINA-FERNÁNDEZ, Hrsg. Integrated Optics: Design, Devices, Systems, and Applications V. Bellingham: SPIE. ISBN 978-1-5106-2729-1. Verfügbar unter: https://doi.org/10.1117/12.2520992

SCHMID, Maximilian, Alexander HANSS, Sri Krishna BHOGARAJU und Gordon ELGER, 2019. Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition. 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-7281-2078-2. Verfügbar unter: https://doi.org/10.1109/THERMINIC.2019.8923548

2018

BHOGARAJU, Sri Krishna, Alexander HANSS, Maximilian SCHMID, Gordon ELGER und Fosca CONTI, 2018. Evaluation of silver and copper sintering of first level interconnects for high power LEDs. 2018 7th Electronic System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-5386-6814-6. Verfügbar unter: https://doi.org/10.1109/ESTC.2018.8546499

CONTI, Fosca, Alexander HANSS, Omid MOKHTARI, Sri Krishna BHOGARAJU und Gordon ELGER, 2018. Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor. New Journal of Chemistry, 42(23), 19232-19236. ISSN 1369-9261. Verfügbar unter: https://doi.org/10.1039/C8NJ04173C

SCHMID, Maximilian und Gordon ELGER, 2018. Measurement of the transient thermal impedance of MOSFETs over the sensitivity of the threshold voltage. EPE'18 ECCE Europe. Piscataway: IEEE. ISBN 978-9-0758-1528-3. Verfügbar unter: https://ieeexplore.ieee.org/document/8515480

HANSS, Alexander, Maximilian SCHMID, Sri Krishna BHOGARAJU, Fosca CONTI und Gordon ELGER, 2018. Process development and reliability of sintered high power chip size packages and flip chip LEDs. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). Piscataway: IEEE, S. 479-484. ISBN 978-4-9902-1885-0. Verfügbar unter: https://doi.org/10.23919/ICEP.2018.8374351

HANSS, Alexander, Maximilian SCHMID, Sri Krishna BHOGARAJU, Fosca CONTI und Gordon ELGER, 2018. Reliability of sintered and soldered high power chip size packages and flip chip LEDs. ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings. Piscataway: IEEE, S. 2080-2088. ISBN 978-1-5386-5000-4. Verfügbar unter: https://doi.org/10.1109/ECTC.2018.00312

HANSS, Alexander und Gordon ELGER, 2018. Residual free solder process for fluxless solder pastes. Soldering & Surface Mount Technology, 30(2), 118-128. ISSN 0954-0911. Verfügbar unter: https://doi.org/10.1108/SSMT-10-2017-0030

ELGER, Gordon, M. BIBERGER, M. MEIER, Helmut SCHWEIGART, Klaus SCHNEIDER und Hüseyin ERDOGAN, 2018. Technische Sauberkeit von Radarbaugruppen. Elektronische Baugruppen und Leiterplatten EBL 2018: Multifunktionale Aufbau- und Verbindungstechnik – Beherrschung der Vielfalt. Düsseldorf: DVS Media GmbH, S. 339-349. ISBN 978-3-96144-026-9. Verfügbar unter: https://www.dvs-media.eu/de/buecher/dvs-berichte/3644/elektronische-baugruppen-und-leiterplatten-ebl-2018

SIGNORINI, Raffaella, Danilo PEDRON, Fosca CONTI, Alexander HANSS, Sri Krishna BHOGARAJU und Gordon ELGER, 2018. Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling. 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-5386-6759-0. Verfügbar unter: https://doi.org/10.1109/THERMINIC.2018.8593304

ELGER, Gordon, Alexander HANSS und Maximilian SCHMID, 2018. Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs. 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-5386-6759-0. Verfügbar unter: https://doi.org/10.1109/THERMINIC.2018.8593278

2015

HANSS, Alexander, Maximilian SCHMID, E LIU und Gordon ELGER, 2015. Transient thermal analysis as measurement method for IC package structural integrity. Chinese Physics B, 24(6), 068105. ISSN 2058-3834. Verfügbar unter: https://doi.org/10.1088/1674-1056/24/6/068105