Through our research in microelectronics and packaging technology, we are driving the development of reliable future mobility solutions.

We develop innovative technologies and materials for packaging and interconnection technology and test electronic systems for their reliability in operation. We analyze failure patterns and failure mechanisms by means of diverse, state-of-the-art analysis methods, which are also used in development in industry. At the same time, we are developing our own test equipment. We are working on methods for condition monitoring and condition prediction of electrical systems. Using these methods, the remaining service life can be predicted while the product is still in operation and the affected electronics can be replaced in good time before failure. In thermomechanical simulations, we simulate the behavior of electronic components under various operating conditions. Optical systems can be developed in detail in optical simulations. This allows more targeted design of electronic and optical components during development and testing for reliability.


Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to