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Project description

  • Process development for electrical and mechanical connection of power equipment components (soldering and sintering) and electrical connection (welding).
  • Development of a non-destructive measurement technique to analyze the quality and reliability of contacts.

 

Project information

Tasks THI Development of measurement technology, process development and reliability analysis
Project partner OSRAM and BMW
Project sponsor Programm zur Förderung der angewandten Forschung und Entwicklung an Hochschulen für angewandte Wissenschaften - Fachhochschulen
Project term 2015 until 2018

 

Contact

  1. Prof. Dr. Gordon Elger

    Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology

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