Project description

  • Development of a new measurement algorithm for transient thermal measurement of power semiconductors to reduce measurement time
  • Testing and evaluation of the algorithm using modern assembly and interconnection concepts (e.g. copper sintering)
  • Development of a measuring stand for the application of the measuring algorithm on commercial products under production line conditions


Project information

Tasks THIDevelopment of measurement algorithm and InLine-Zth-equipment
ProjectpartnerRobert Bosch GmbH

Programm zur Förderung der angewandten Forschung und Entwicklung an Hochschulen für angewandte Wissenschaften, Bayerisches Staatsministerium für Wissenschaft und Kunst 

Projectterm01/01/2019 until 12/31/2021



Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to