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Project description

  • Development of a new measurement algorithm for transient thermal measurement of power semiconductors to reduce measurement time
  • Testing and evaluation of the algorithm using modern assembly and interconnection concepts (e.g. copper sintering)
  • Development of a measuring stand for the application of the measuring algorithm on commercial products under production line conditions

 

Project information

Tasks THI Development of measurement algorithm and InLine-Zth-equipment
Projectpartner Robert Bosch GmbH
Projectsponsor

Programm zur Förderung der angewandten Forschung und Entwicklung an Hochschulen für angewandte Wissenschaften, Bayerisches Staatsministerium für Wissenschaft und Kunst 

Projectterm 01/01/2019 until 12/31/2021

 

Contact

  1. Prof. Dr. Gordon Elger

    Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology

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