Project description

Development of an improved process for measuring the thermal impedance of LED modules. Imprinting optical rather than electrical power to study thermal behavior.


  • Possibility of accelerated alternation between heating and cooling process
  • Higher resolution/accuracy in the determination of the thermal network, stochastic system description


Project information

Tasks THIPackaging and interconnection technology, materials research and process development
Project partnerOSRAM Opto Semiconductors GmbH
Project sponsorResearch at UAS with Companies (FHprofUnt), Federal Ministry of Education and Research
Project term07/01/2019 until 06/30/2022



Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to