Prof. Dr. Gordon Elger
Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology
Project description
Development of an improved process for measuring the thermal impedance of LED modules. Imprinting optical rather than electrical power to study thermal behavior.
Perspectives:
- Possibility of accelerated alternation between heating and cooling process
- Higher resolution/accuracy in the determination of the thermal network, stochastic system description
Project information
| Tasks THI | Packaging and interconnection technology, materials research and process development |
| Project partner | OSRAM Opto Semiconductors GmbH |
| Project sponsor | Research at UAS with Companies (FHprofUnt), Federal Ministry of Education and Research |
| Project term | 07/01/2019 until 06/30/2022 |