2020:

  • Bhogaraju, S. K., Mokhtari, O., Conti, F., & Elger, G. (2020). Die-attach bonding for high temperature applications using thermal decomposition of copper (II) formate with polyethylene glycol. Scripta Materialia, 182, 74-80.

2019:

  • Mokhtari, O., Conti, F., Bhogaraju, S. K., Meier, M., Schweigart, H., Tetzlaff, U., & Elger, G. (2019). Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor. New Journal of Chemistry, 43(26), 10227-10231.

  • Mokhtari, O. (2019). A review: Formation of voids in solder joint during the transient liquid phase bonding process-Causes and solutions. Microelectronics Reliability, 98, 95-105.

2018:

  • Conti, F., Hanss, A., Mokhtari, O., Bhogaraju, S. K., & Elger, G. (2018). Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor. New Journal of Chemistry, 42(23), 19232-19236.

  • Hanss, A., & Elger, G. (2018). Residual free solder process for fluxless solder pastes. Soldering & Surface Mount Technology.

2017:

  • Liu, E., Zahner, T., Besold, S., Wunderle, B., & Elger, G. (2017). Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectronics Reliability, 79, 533-546.

2016:

  • Elger, G., Müller, D., Hanß, A., Schmid, M., Liu, E., Karbowski, U., & Derix, R. (2016). Transient thermal analysis for accelerated reliability testing of LEDs. Microelectronics Reliability, 64, 605-609.

  • Liu, E., Hanss, A., Schmid, M., & Elger, G. (2016). The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs. Microelectronics Reliability, 67, 29-37.

  • Conti, F., Hanss, A., Fischer, C., & Elger, G. (2016). Thermogravimetric investigation on the interaction of formic acid with solder joint materials. New Journal of Chemistry, 40(12), 10482-10487.

2015:

  • Alexander, H., Maximilian, S., Liu, E., & Gordon, E. (2015). Transient thermal analysis as measurement method for IC package structural integrity. Chinese Physics B, 24(6), 068105.

  • Elger, G., Kandaswamy, S. V., Liu, E., Hanss, A., Schmid, M., Derix, R., & Conti, F. (2015). Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectronics Journal, 46(12), 1230-1238.

2014:

  • Elger, G., Hutter, M., Rauschenbach, S., & Willwohl, H. (2014, May). Performance of improved SAC solders under high thermo-mechanical stress condition. In Proceedings of IEEE Electronics Circuits World Convention (ECWC13).

  • Elger, G., Kandaswamy, S. V., Derix, R., & Wilde, J. (2014). Transient thermal analysis as a highly sensitive test method for the reliability investigation of high power LEDs during temperature cycle tests. Journal of Microelectronics and Electronic Packaging, 11(2), 51-56.

2013:

  • Elger, G., Kandaswamy, S. V., Derix, R., & Wilde, J. (2013, January). Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests. In International Symposium on Microelectronics (Vol. 2013, No. 1, pp. 000902-000907). International Microelectronics Assembly and Packaging Society.

2019:

  • Bhogaraju, S. K., Mokhtari, O., Pascucci, J., Conti, F., Kotadia, H. R., & Elger, G. (2019, October). A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization. In International Symposium on Microelectronics (Vol. 2019, No. 1, pp. 000387-000392). International Microelectronics Assembly and Packaging Society.

  • Bhogaraju, S. K., Mokhtari, O., Pascucci, J., Hanss, A., Schmid, M., Conti, F., & Elger, G. (2019, September). Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging. In 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (pp. 1-8). IEEE.

  • Bhogaraju, S. K., Mokhtari, O., Pascucci, J., Conti, F., & Elger, G. (2019, July). Improved sinterability of particles to substrates by surface modifications on substrate metallization. In Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (Vol. 2019, No. HiTen, pp. 000066-000070). International Microelectronics Assembly and Packaging Society.

  • Signorini, R., Conti, F., Brugnolotto, E., Pedron, D., Liu, E., Bhogaraju, S. K., & Elger, G. (2019, April). Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy. In Integrated Optics: Design, Devices, Systems, and Applications V (Vol. 11031, p. 110310I). International Society for Optics and Photonics.

  • Liu, E., Conti, F., Signorini, R., Brugnolotto, E., Bhogaraju, S. K., & Elger, G. (2019, March). Modelling thermo-mechanical stress in GaN-LEDs soldered on copper substrate with simulations validated by Raman experiments. In 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-8). IEEE.

  • Hanss, A., Liu, E., Abdullah, M. R., & Elger, G. (2019, March). Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models. In 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-7). IEEE.

  • Brugnolotto, E., Bhogaraju, S. K., Liu, E., Conti, F., Pedron, D., Signorini, R., & Elger, G. (2019, September). Investigation of Thermomechanical Local Stress Induced in Assembled GaN LEDs. In 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). IEEE.

  • Schmid, M., Krishna, B. S., & Elger, G. (2019, May). Automatic Transient Thermal Impedance Tester for Quality Inspection of Soldered and Sintered Power Electronic Devices on Panel and Tile Level. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 2324-2330). IEEE.

  • Schmid, M., Hanss, A., Bhogaraju, S. K., & Elger, G. (2019, September). Time Saving Averaging Algorithm for Transient Thermal Analyses over Deterministic Pulse Superposition. In 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). IEEE.

2018:

  • Maximilian, S., & Elger, G. (2018, September). Measurement of the Transient Thermal Impedance of MOSFETs Over the Sensitivity of the Threshold Voltage. In 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe) (pp. P-1). IEEE.

  • Hanss, A., Schmid, M., & Elger, G. (2018, December). Combined Accelerated Stress Test with In-Situ Thermal Impedance Monitoring to Access LED Reliability. In 2018 20th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-4). IEEE.

  • Signorini, R., Pedron, D., Conti, F., Hanss, A., Bhogaraju, S. K., & Elger, G. (2018, September). Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling. In 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). IEEE.

  • Elger, G., Hanss, A., & Schmid, M. (2018, September). Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs. In 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). IEEE.

  • Maximilian, S., & Elger, G. (2018, September). Measurement of the Transient Thermal Impedance of MOSFETs Over the Sensitivity of the Threshold Voltage. In 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe) (pp. P-1). IEEE.

  • Bhogaraju, S. K., Hanß, A., Schmid, M., Elger, G., & Conti, F. (2018, September). Evaluation of silver and copper sintering of first level interconnects for high power LEDs. In 2018 7th Electronic System-Integration Technology Conference (ESTC) (pp. 1-8). IEEE.

  • Hanss, A., Schmid, M., Bhogaraju, S. K., Conti, F., & Elger, G. (2018, May). Reliability of sintered and soldered high power chip size packages and flip chip LEDs. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2080-2088). IEEE.

  • G. Elger, M. Biberger, M. Meier, H. Schweigart, K. Schneider, H. Erdogan, Technische Sauberkeit von Radarbaugruppen, Elektronische Baugruppen und Leiterplatten EBL, 2018, Fellbach, Germany.

  • Hanss, A., Schmid, M., Bhogaraju, S. K., Conti, F., & Elger, G. (2018, May). Reliability of sintered and soldered high power chip size packages and flip chip LEDs. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2080-2088). IEEE.

  • Hanss, A., Schmid, M., Bhogaraju, S. K., Conti, F., & Elger, G. (2018, April). Process development and reliability of sintered high power chip size packages and flip chip LEDs. In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 479-484). IEEE.

  • Hanss, A., & Elger, G. (2018). Residual free solder process for fluxless solder pastes. Soldering & Surface Mount Technology.

2017:

  • Saparia, S., Tandon, S., Liu, E., Zahner, T., Besold, S., Kalb, W., & Elger, G. (2017, September). Calibration of transient FE simulation: Improvement of post-processing and simulation automation. In 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). IEEE.

  • Tandon, S., Liu, E., Zahner, T., Besold, S., Kalb, W., & Elger, G. (2017, April). Transient thermal simulation of high power LED and its challenges. In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-8). IEEE.

  • Schmid, M., Pforr, J., & Elger, G. (2017, May). Power Electronic Package for Double Sided Cooling Utilizing Tile-Level Assembly. In PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-7). VDE.

  • Hanss, A., Liu, E., Schmid, M., Müller, D., Karbowski, U., Derix, R., & Elger, G. (2017, May). New Method to Separate Failure Modes by Transient Thermal Analysis of High Power LEDs. In 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (pp. 1136-1144). IEEE.

  • G. Elger, M. Schmid, A. Hanß, D. Müller, Automatic Panel Level Transient Thermal Tester, in Proc. of the 7. LED Professional Symposium, Bregenz, Austria (Ed.: S. Luger) 2017, 594–602

  • Liu, E., Zahner, T., Besold, S., Wunderle, B., & Elger, G. (2017). Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectronics Reliability, 79, 533-546.

2016:

  • E Liu, Z. Ma, A. Hanss, L. Zhao, G. Elger, Practical international standard for transient thermal resistance measurements for LEDs, Solid State Lighting China, 2016, Beijing, China.

  • Liu, E., Ankit, B. R., & Gordon, E. (2016, August). Assessment of assembly quality of Chip scale Package LEDs on insulated metal substrate. In 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (pp. 119-124). IEEE.

  • Hanß, A., Schmid, M., & Elger, G. (2016, September). Self alignment of flip chip LEDs on PCB for high position accuracy. In 2016 6th Electronic System-Integration Technology Conference (ESTC) (pp. 1-6). IEEE.

  • Hanss, A., Hutter, M., Trodler, J., & Elger, G. (2016, May). Solder process for fluxless solder paste applications. In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (pp. 447-454). IEEE.

  • G. Elger, A. Hanss, M. Schmid, E Liu, U. Karbowski, R. Derix, Reliability Monitoring of Miniaturized LED Light Sources , Smart System Integration, München, 2016, 130-137.

  • Hanss, A., Hutter, M., Trodler, J., & Elger, G. (2016, May). Solder process for fluxless solder paste applications. In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (pp. 447-454). IEEE.

  • G. Elger, D. Müller, A. Hanß, M. Schmid, E Liu, U. Karbowski, R. Derix, Transient Thermal Analysis for Accelerated Reliability Testing of LEDs, in Proc. of the 27. European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Halle (Saale), Deutschland (Ed.: ECPE) 2016

2015:

  • Zuverlässigkeitsuntersuchungen von LED-Modulen mit Hilfe der Transienten Thermischen Analyse, 4. VDI-Konferenz Lebensdauer und Zuverlässigkeit in der LED-Beleuchtung 10. und 11. Juni 2015 in Düsseldorf

  • Liu, E., Hanss, A., Schmid, M., & Elger, G. (2015). The influence of phosphor layer and sidecoating on the thermal performance and the structure function of modern waver level high power LEDs. In 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-4). IEEE.

  • Hanss, A., Liu, E., Schmid, M., & Elger, G. (2015). The influence of voids in solder joints on thermal performance and reliability investigated with transient thermal analysis. In 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). IEEE.

  • Elger, G., Schmid, M., Hanß, A., Liu, E., Klein, M. J., Karbowski, U., & Derix, R. (2015, May). Analysis of new direct on PCB board attached high power flip-chip LEDs. In 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (pp. 1310-1317). IEEE.

  • Liu, E., Hanss, A., Schmid, M., & Elger, G. (2015). The influence of phosphor layer and sidecoating on the thermal performance and the structure function of modern waver level high power LEDs. In 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-4). IEEE.

2014:

  • Elger, G., Hanss, A., Schmid, M., & Wipiejewski, T. (2014, November). Application of thermal analysis for the development of reliable high power LED modules. In 2014 11th China International Forum on Solid State Lighting (SSLCHINA) (pp. 158-164). IEEE.

  • Elger, G., Hutter, M., Rauschenbach, S., & Willwohl, H. (2014, May). Performance of improved SAC solders under high thermo-mechanical stress condition. In Proceedings of IEEE Electronics Circuits World Convention (ECWC13).

  • Kandaswamy, S. V., Tetzlaff, U., Derix, R., & Elger, G. (2014, October). Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations. In International Symposium on Microelectronics (Vol. 2014, No. 1, pp. 000055-000061). International Microelectronics Assembly and Packaging Society.

  • Elger, G., Kandaswamy, S. V., Derix, R., & Conti, F. (2014, September). Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis. In 20th International Workshop on Thermal Investigations of ICs and Systems (pp. 1-6). IEEE.

  • Elger, G., Kandaswamy, S. V., von Kouwen, M., Derix, R., & Conti, F. (2014, May). In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (pp. 1464-1470). IEEE.

2013:

  • Elger, G., Spinger, B., Bienen, N., & Benter, N. (2013, May). LED matrix light source for adaptive driving beam applications. In 2013 IEEE 63rd Electronic Components and Technology Conference (pp. 535-540). IEEE.

  • Elger, G., Kandaswamy, S. V., Derix, R., & Wilde, J. (2013, January). Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests. In International Symposium on Microelectronics (Vol. 2013, No. 1, pp. 000902-000907). International Microelectronics Assembly and Packaging Society.

  • Transiente Thermische Analyse als Messmethode für die Zuverlässigkeit von High Power LEDs, Deutsche IMAPS-Konferenz, 17-18.10.2013.

  • LED Packaging – Gegenwart und Zukunft, Tutorial, SMT Hybrid Packaging, Internationale Fachmesse und Kongress für Systemintegration in der Mikroelektronik, Nürnberg, 16.- 18.04.2013

Kontakt

Forschungsprofessor für Aufbau- und Verbindungstechnik
Prof. Dr. Gordon Elger
Tel.: +49 841 9348-2840
Raum: A114
E-Mail:

Offene Stellen

Falls Sie Interesse an offenen Stellen für Studentische Arbeiten innerhalb der Forschungsgruppe haben, senden Sie bitte eine Mail mit Lebenslauf an gordon.elger@thi.de.