Microelectronic systems and the associated packaging technology are the key technology of current and future mobility solutions. Increasing miniaturization of electronic systems combined with increasing performance and lifetime require the development of new reliable materials, improvement of existing assembly and interconnection techniques as well as the extension of existing analysis and test methods. The focus of our research is on applications in optoelectronics (LED modules) and power electronics.
Due to our close cooperation with various companies from the automotive industry, packaging and interconnection technology, optics manufacturers and many more in different research cooperations, we work very close to the application and always on the most current topics of microelectronics and packaging and interconnection technology. In addition, this enables our students to gain initial insights into possible professional fields in the aforementioned research areas.
Reliable operation of electronic systems over their lifetime is essential. This must be ensured, especially in the automotive sector with its high safety requirements. High operating temperatures and strong mechanical and thermomechanical stress influence the reliability of the systems and require advanced and reliable assembly and interconnection technologies.