Wire bonder

Equipment description

This wire bonder can be configured for aluminum or gold wire bonding. Each uses its own spool and bond tool(s). Ball bonding can also be performed with gold wire. The stereo microscope has an adjustable focus and zoom, and is equipped with a CCD camera. The heated stage allows substrate temperatures up to 250° C. Bond Parameters in this machine (for Bonds 1 and 2) are:

• Ultrasonic power (analog of “power” on K&S and MEI bonders) in arbitrary units
• Time – Duration of ultrasonic application in milliseconds
• Force – Downward force applied by bonding tool during bond in grams

Equipment information