Our research lab collaborates in a co-development mode with national and international companies in materials and test equipment development, processing, packaging and assembly techniques, and transferring both the new technologies and the educated engineers to provide a path for commercialization of the new technologies.
Research projects
- SMART ADAS (2019-present)
Industrial partner: ContiTemic microelectronic GmbH and mts Consulting & Engineering GmbH
- IQLED (2019-present)
Industrial partner: OSRAM Opto Semiconductors GmbH
- ProLoMa (2018-present)
Industrial partner: ContiTemic microelectronic GmbH
- Development of new Cu-particle paste for high-temperature electronics applications,
- Development of a novel processing technique for sintering Cu-particles,
- Development of a new SnAgCu solder alloy with a lower Ag content for high-temperature electronics applications.
- Wafer level die bond tester (WLD) (2016-2018)
Industrial partner: OSRAM Opto Semiconductors GmbH
- Automated High-Volume Thermal Resistivity Tester (Wafer-Level) forLEDs.
- Reliable Contacts (ZuKo) (2015-2018)
Industrial partner: OSRAM Opto Semiconductors GmbH and BMW.
- Process development for the electrical and mechanical interconnection for the components of the power devices (soldering and sintering) and of electrical connections (welding),
- Development of non-destructive measuring technology for the analysis of the quality and reliability of the contacts.
- Visi0n (2015-2018)
Industrial partner: ContiTemic microelectronic GmbH and Anylink GmbH
- Error analysis of manufacturing processes,
- Fault analysis and test method development for complex electronic modules (driver assistance systems).
- BayChina (2015-2017)
Research partner: Chinese Academic of Science
- Standardization of k-factor-free transient thermal analysis.
- Smart LEDs (2014-2019)
Industrial partner: Lumileds Germany GmbH und Heraeus Deutschland GmbH & Co. KG
- Assembly and interconnection technology for novel adaptive LED headlamps and test methods for investigating the reliability of the LED modules,
- Development of a flux-free solder paste process for LED modules,
- Development of a measurement method for reliability and lifetime predictions of the LED modules,
- Analysis of driver architecture.
Contact
Head of Research Group Microelectronics Packaging
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail: Gordon.Elger@thi.de
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail: Gordon.Elger@thi.de
Open positions
If you are interested in vacancies for student work within the research group, please send an email with CV to gordon.elger@thi.de.