Research projects

  • SMART ADAS (2019-present)
    Industrial partner: ContiTemic microelectronic GmbH and mts Consulting & Engineering GmbH
  • IQLED (2019-present)
    Industrial partner: OSRAM Opto Semiconductors GmbH
  • ProLoMa (2018-present)
    Industrial partner: ContiTemic microelectronic GmbH
    - Development of new Cu-particle paste for high-temperature electronics applications,
    - Development of a novel processing technique for sintering Cu-particles,
    - Development of a new SnAgCu solder alloy with a lower Ag content for high-temperature electronics applications.
  • Wafer level die bond tester (WLD) (2016-2018)
    Industrial partner: OSRAM Opto Semiconductors GmbH
    - Automated High-Volume Thermal Resistivity Tester (Wafer-Level) forLEDs.
  • Reliable Contacts (ZuKo) (2015-2018)
    Industrial partner: OSRAM Opto Semiconductors GmbH and BMW.
    - Process development for the electrical and mechanical interconnection for the components of the power devices (soldering and sintering) and of electrical connections (welding),
    - Development of non-destructive measuring technology for the analysis of the quality and reliability of the contacts.
  • Visi0n (2015-2018)
    Industrial partner: ContiTemic microelectronic GmbH and Anylink GmbH
    - Error analysis of manufacturing processes,
    - Fault analysis and test method development for complex electronic modules (driver assistance systems).
  • BayChina (2015-2017)
    Research partner: Chinese Academic of Science
    - Standardization of k-factor-free transient thermal analysis.
  • Smart LEDs (2014-2019)
    Industrial partner: Lumileds Germany GmbH und Heraeus Deutschland GmbH & Co. KG 
    - Assembly and interconnection technology for novel adaptive LED headlamps and test methods for investigating the reliability of the LED modules,
    - Development of a flux-free solder paste process for LED modules,
    - Development of a measurement method for reliability and lifetime predictions of the LED modules,
    - Analysis of driver architecture.

 

Contact

Head of Research Group Microelectronics Packaging
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail: