Research Areas

Mobility in the future will be optimized in terms of energy efficiency and customer benefit. The major focus lies on: combustion and electric motors, power electronics, powertrain, energy storage, fuels, electrical consumers, energy networks and their interaction. In addition to innovative functional developments and operating strategies, the topics of networked mobility, Industry 4.0 and Smart Cities are increasingly being incorporated into the projects.

Research Group

Packaging is a key technology for microelectronics manufacturing. Miniaturization of electrical systems with simultaneously increasing power demand improvement in interconnecting materials, interconnecting processes, and the thermal management. The Internet of Things (IoT) was and is only made possible by the innovations in assembly and connection technology. Also, in the automotive sector high operating temperatures under heavy mechanical and thermomechanical load, demand advanced and reliable interconnects. With ever-increasing requirements specially in case of safety and reliability,  the advanced microelectronic interconnects have prominent roles in driving the future.

This research group deals with the assembly and testing of electrical modules and systems. The focus of this team is on the applications for optoelectronics (LED modules) and power electronics. The key aspect for the electronic package is reliability, i.e. the faultless functioning over the longest possible service life. This research group develops nondestructive electrical test methods to study the reliability of the modules in accelerated aging tests. The reliability of solder joints is investigated at this laboratory as a function of solder metallurgy as well as the soldering process. This laboratory has developed an automated measuring system and an evaluation method to perform in-situ and ex-situ testings, with high sensitivity, on the mechanical integrity of electronic assemblies.

Because the temperature of the semiconductor affects the life-time of the semiconductors, thermal management has great importance for its reliability. Therefore, Transient Thermal Analysis (TTA) as a novel method has been used in this research group to investigate the thermal resistance in the electrical systems. Based on these measurements, finite element (FE) and computational fluid dynamics (CFD) models are created and validated. Simulations predict the temperature and optimize the design of the electronic systems.

Contact

Head of Research Group Microelectronics Packaging
Prof. Dr. Gordon Elger
Phone: +49 841 9348-2840
Room: A114
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to gordon.elger@thi.de.